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Soochow University
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Huawei
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凌云
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Industry Forum 1: Optical Circuit Switching (OCS) for AI Reconfigurable Datacenter Network (RDCN): Devices, Systems and applications


Description: 

The advent of AI/ML has accelerated scaling of training compute capacity, driving the required computation demands to double approximately every 6 months. Reflecting the recent slow-down in Moore's law and the explosion workload, the performance, latency and power consumption ofnetworks are becoming barriers in hyper scale data centres. One potential innovative solution is reconfigurable datacenter network (RDCN): datacenter networks whose large-scale topologies dynamically change over time enabled by optical circuit switching(OCS) technology. 


OCS, however, introduces new problems. First, this is a change of paradigm that has a large impact on the network operation and management. New traffic engineering techniques have to be defined to benefit from OCS. Lower, deterministic latency impact on congestion and cannot be fully leveraged without changes of the layer-4 (TCP) protocols. The switching chip itself is adding losses, which need to be included in the transponder design or data center planning. The failure model of OCS switches is still relatively unknown and the impact of the failure of a single OCS in a data center may lead to dramatic traffic losses. 


This industry forum aims to bring together leading academics and industry researchers to explore advances in devices and systems on optical circuit switching (OCS), AI RDCN structures and protocols, and in-depth discussion on future AI/ML data centre powered by optical circuit switching (OCS) technology.


Time: 09:00-12:00, November 8

Venue: Function Room K3, 1F


Organizers:

Kangping Zhong, The Hong Kong Polytechnic University

Yvan Pointurier, Huawei France

Xian Zhou, University of Science and Technology Beijing

Hua Zhang, LUSTER LightTech Co., Ltd.


Speakers:

Presider: Xian Zhou, University of Science and Technology Beijing

09:00-09:15  Xiaoliang Chen, University of Science and Technology of China

Topic: Spatial and Temporal Scheduling for Accelerating LLM Training in OCS-based DCNs

09:15-09:30 Yuyang Liu, China Telecom

Topic: Practice of OCS-based large-scale data center intra-connection network

09:30-09:45  Rentao Gu, Beijing University of Posts and Telecommunications

Topic: ReFly: A Reconfigurable Architecture for LLM Training Based on Optical Circuit Switching

09:45-10:00  Daniel Perez-Lopez, IPronics

Topic: Fast silicon photonics switches and main AI datacenter applications

10:00-10:30  Coffee Break

Presider: Hua Zhang, LUSTER LightTech Co., Ltd.

10:30-10:45  Mingqing Zuo, China Mobile

Topic: AI-Computing-Oriented All-Optical Network: Requirement, Challenge, and Technology

10:45-11:00  Guangpeng Ma, Lumentum

Topic: Optical Circuit Switching - Opportunity and Challenges

11:00-11:15  Hua Zhang, Luster Light Co., Ltd.

Topic: Discussion on optical interconnection technology for AI Reconfigurable Data Center Network

11:15-11:30  Guanghui Sun, Huawei Technologies Co., Ltd.

Topic: Optical interconnection helps release AI computing power

Presider: Kangping Zhong, The Hong Kong Polytechnic University

11:30-12:00  Panel Discussion



Industry Forum 2: The Deep-Sea Technology Forum


Description: 

The Deep-Sea Technology Forum, led by Hengtong Group and supported by the Jiangsu Marine Information Technology and Equipment Innovation Center, will take place in Suzhou from November 5th to 8th. It aims to create an innovation platform for future marine industries, deepen the research and development of common technologies, and establish a marine technology R&D highland in the Asia-Pacific region.


The forum will gather authoritative experts from top marine academic institutions. They will deliver reports and share insights. Participants will discuss the latest achievements and cutting-edge practices in marine communication and perception, analyze technological trends, and predict the industry’s future direction, promoting innovation and development in the Asia-Pacific’s deep-sea technology sector.


Additionally, the forum will facilitate joint efforts in key projects and promote the integration and sharing of innovative resources. Through discussions and exchanges, the forum aims to integrate R&D with commercial innovation in marine communication and perception in the Asia-Pacific region.


Time: 09:00-12:00, November 8

Venue: Function Room K5, 1F


Organizers:

Xu Lin, HMN Technologies Group Co., Ltd

Song Ji'en, Ocean Optics Materials and Technology Committee, Chinese Society for lmaging Science and Technology


Speakers:

Presider: Kai Yao, HMN TECH

09:00-09:15 Charles Jeremy Brown, Hengtong HMN Group Co., Ltd

Topic: A Look Back in History The 8 Key Chinese lnventions Enabling the Subsea Cable lndustry as we knowit today

09:15-09:30 Takemi Hasegawa, Sumitomo Electric Industries, Ltd., Japan

Topic: Recentadvancesin submarine optical fibers

09:30-09:45 Shanshan Wang, Ocean University of China

Topic: Application of Optical Fiber Sensing Technology in Sensing and Measurement of Marine Physical Parameters

09:45-10:00 Haokun Song, China Mobile

Topic: Prevention and Detection Technologies for Submarine Cable System Maintenance

10:00-10:30 Coffee Break

10:30-10:45 Haocai Huang, Zhejiang University

Topic: SMART Cable: Enabling Ocean Monitoring Through the Convergence of Existing Submarine Telecom Cables andMarine Sensing in China

10:45-11:00 Tommy Geisler, OFS Fitel, LLC, Japan

Topic: Ulitra-Low Loss fibers for submarine cable systems, trans-oceanic and SDM high fiber count cable systems

11:00-11:15 Mengmeng Zhang, HMN Technologies Co., Limited

Topic: From Connected to Intelligent: The Next Wave in Submarine Networks

Presider: Rendong Xu, Zhejiang University

11:15-12:00 Panel Discussion



Industry Forum 3: Optical interconnects for AI computing


Description: 

Datacenters have driven the fast development of pluggable optics in the past decade. Even the speeds of pluggable optical transceivers have been increased about 20 times, from 40 Gb/s a decade ago to 800 Gb/s today, they still fall behind switch ASIC bandwidth increase, which is about 100 times. Since 2023, generative AI has generated unprecedented demands on optical interconnects. AI computing clusters not only demand much larger interconnect bandwiths than before, but have higher requirements on power consumption, bandwidth density, latency and reliabilty for optical interconnects as well. Will pluggable optics contimue to be the main optical interconnect technologies for AI computing? Will new technologies including NPO, CPO, and OIO be better positioned for AI computing interconnects? This forum will bring together experts from various segments in our indusrty including end users, system vendors, optical transceiver and chip companies to discuss these questions.  


Time: 08:30-12:15, November 8

Venue: Function Room K4, 1F


Organizers:

Chongjin Xie, PhotonicX AI Pte. Ltd.

Hanxing Shi, OpenLight Photonics Inc.

Hua Zhang, Luster LightTech Co. Ltd.


Speakers:

Presider: Chongjin Xie, PhotonicX AI Pte. Ltd.

08:30-08:45  Rui Lu, Alibaba Cloud

Topic: The Changes of AI Cloud Optical Interconnects

08:45-09:00  Sidong Fu, Tencent

Topic: Evolution of Optical Interconnect Technologies for AI Computing Networks

09:00-09:15  Shaoliang Yu, Zhijiang Lab 

Topic: Linear-Drive Optics for AI Clusters: Bandwidth, Power, and Reliability

09:15-09:30  Guangcan Mi, Huawei Technologies Co., Ltd.

Topic: Next Generation Ethernet: Challenges and Progress of 448G Signals

09:30-09:45  Ningfeng Tang, ZTE Corporation

Topic: Optical Interconnect Industry Outlook for Intelligent Computing Centers

09:45-10:00  Lei Wang, Pengcheng Lab

Topic: Optical devices for different reaches interconnects for AI computing

10:00-10:30  Coffee Break

Presider: Hanxing Shi, OpenLight Photonics Inc.

10:30-10:45  Yaotian Zhao, Zhangjiang Lab

Topic: Silicon photonics for short-reach interconnects: progress in high-bandwidth and energy-efficient optical I/O

10:45-11:00  Steve Alleston, OpenLight Photonics Inc.

Topic: Enabling High speed Interconnects for AI with Heterogeneous Integration

11:00-11:15  Jinyu Mo, POET Technologies Pte. Ltd.

Topic: Semiconductorization of Photonics: An Optoelectronics Integration Platform for Next-Generation AI Computing and Data Center

11:15-11:30  Frank Chang, Source Photonics Inc.

Topic: Exploring AI network evolution and next path towards 448G/L IMDD for AI computing

11:30-11:45  Xu Sun, Crealights Technology Co. Ltd.

Topic: Trends of Large-scale Silicon Photonics Interconnection——Breaking the Bottleneck of Optical Interconnect Mass Production

11:45-12:15  Panel Discussion