Advanced opto-electronic and optical fiber packaging

Advanced opto-electronic and optical fiber packaging

Description: 

OE packages for CPO, NPO, XPO, OIO, OCI, OCS and so on; Advanced 2.5D/3D packaging of PIC and EIC; Advanced optical fiber packaging and fiber assembly unit; Optical interposer and bridge; Micro and meta lens and packaging devices by silicon, silica, and so on;

Time: November 1, 2026 | 08:30-11:30

Venue: Conference Room 102A, 1F

Organizers:

Jiangbing Du, Shanghai Jiao Tong University

Xingjun Wang, Peking University

Wei Chu, Zhangjiang Laboratory

Yang Cheng, JCET Group Co., Ltd.

Shaoliang Yu, Zhejiang Lab

Linjie Zhou, Shanghai Jiao Tong University

Agenda:

Presider: Jiangbing Du, Shanghai Jiao Tong University

08:30-08:45 Ting Lei, Shenzhen Photonics Valley Technology

Title: Glass-based 3D Waveguides: A New Path for AI Optical Interconnection

08:45-09:00 Li Geng, HM Microelectronies Integration Technology Co., ltd

Title: CPO : Advanced Packaging Processes and Industrialization from Sample to Mass Production

09:00-09:15 Erse Jia, Zhangjiang Laboratory

Title: High-speed modulators and opto-electronic Co-Packaging Based on Advanced Silicon Photonics Platform

09:15-09:30 Anjin Liu, Institute of Semiconductors, Chinese Academy of Sciences

Title: VCSELs for optical interconnects in hybrid computing systems

09:30-09:45 Pengfei Tian, Fudan University

Title: Ultra-low-power high-speed micro-LED optical interconnects

09:45-10:00 Xueyan Zheng, Westlake Institute for Optoelectronics, Westlake University

Title: Optoelectronic Co-Packaging: Empowering AI

10:00-10:30 Coffee Break

Presider: Ting Lei, Shenzhen University

10:30-10:45 Guangyong Chu, Yuechun Shi, Yongjiang Laboratory

Title: Dynamic Simulation and  Design of DFB  semiconductor Lasers Using Transmission-Line Model

10:45-11:00 Yuyao Guo, Shanghai Jiao Tong University

Title: Multimaterial Photonic Packaging-Enabled Tunable Low-Noise Lasers and Their Applications

11:00-11:15 Bin Zhang, Zhejiang University

Title: Co-Design of High-Bandwidth Silicon Photonics Integration, Packaging, and Optical Interconnect Systems for Next-Generation AI Data Centers

11:15-11:30 Zhimin Yu, Peking University

Title: Interlayer-Free InP-on-SOI Bonding for III-V/Si Photonic Integration