Next Generation AI Optical Interconnects

Next Generation AI Optical Interconnects

Description: 

AI datacenters are growing at an unprecedented pace and photonics will play a key role in  scaling to ever higher computational powers. This workshop will provide a comprehensive technical deep dive into how innovative photonics solutions can increase performance, energy-efficiency and scalability. The first part of the workshop will take a deep look into the evolution of standards for AI-datacenter networks, novel integrated photonic concepts for transceivers and switches as well as next generation pluggable transceivers. In the second part a comprehensive technical deep dive into the Optical Compute Interconnect (OCI) Multi-Source Agreement (MSA), the emerging open standard designed to break the copper barrier in AI scale-up architectures will be given and implementation pathways will be explored.

Time: November 1, 2026 | 13:30-17:15

Venue: Conference Room 206, 2F

Organizers:

Stephan Pachnicke, Kiel University, Germany

Vivian Chen, Nokia Bell Labs, USA

Ting Wang, Shanghai Jiao Tong University, China

Agenda:

Session 1: Intra-Datacenter Communications and the Role of Photonics in Future AI Datacenter Networks- Presider: Stephan Pachnicke

13:30-13:45 Xiang Liu, Huawei

Title: Overview of Optical Standardization on FPO/XPO/NPO/OCS for AI-Datacenter Networks

13:45-14:00 Son Thai Le, Ciena

Title: Silicon-Photonics Optics Engines for AI Datacenters

14:00-14:15 Jose Capmany,  iPRONICS / UPV

Title: The Role of Programmable Photonics for Future AI Datacenters

14:15-14:30 Jim Zou, Adtran

Title: Pluggable Optics for the Evolving Needs of the AI Supercycle

14:30-14:45 Dmitrii Briantcev, Trinity College Dublin

Title: Future AI Fabrics: What Role will Optics Play?

14:45-15:00 Magnus Fischer, Kiel University

Title: Will Electrical or Optical BiDi Systems Reshape Future Scale-Up Networks?

15:00-15:30 Coffee Break

Session 2: OCI Standards and Implementation Pathways - Presider: Ting Wang

15:30-15:45 Nan Qi, LuxSilicon

Title: TBA

15:45-16:00 Liangjun Lu, Photonic Nexus

Title: Heterogeneous Photonic Integrated Circuits for High-Performance Communication

16:00-16:15 Zhiyuan Li, Huawei

Title: TBA

16:15-16:30 Shujie Pan, HS Photonics

Title: III-V QD comb for next generation CPO/OIO

16:30-16:45 Xinlun Cai, Niobate

Title: TBA

16:45-17:15 Panel Discussion